PIONEER OF DIGITAL TECH
PDT specializes in the manufacture and sales of factory automation facilities such as Semiconductor manufacturing equipment and FPD manufacturing equipmentChemical Electronic Materials
SmartPlate ™ and SmartVia ™
Using High-Tech plating technology, the quality of copper plating such as the thickness, form, flatness, uniformity and speed can be controlled by organic additives.
Our company has a competitive edge over other foreign companies being faster in mass production by responding to customers and extruding experimental results faster.
We have overcome our disadvantage of not being able to store imported organic additives more than 6 months, by localizing the production in Korea.
SmartPlate™
- High purity Cu deposition
- Excellent uniformity
- Smooth surface
- High bath stability
- Adjustable bump/pillar shape
- Easy process control & monitoring
- Long storage time
- Convenient after-sales service
Current Density | Plating Speed | Pillar Shape |
5-12 ASD | 1.0-2.5μm/min | Flat or Dish |
Resistivity(as-plated) | Roughenss | Uniformity |
< 2.1 μΩ . cm | 6.0 nm | < 2 % |
SmartVia™
CURRENT dENSITY 1.1 ASD
CURRENT dENSITY 1.3 ASD
Current Density | Resistivity (as-plated) |
0.5-1.3 ASD | < 2.1 μΩ . cm |