PIONEER OF DIGITAL TECH

PDT specializes in the manufacture and sales of factory automation facilities such as Semiconductor manufacturing equipment and FPD manufacturing equipment

Chemical Electronic Materials

SmartPlate ™ and SmartVia ™
Using High-Tech plating technology, the quality of copper plating such as the thickness, form, flatness, uniformity and speed can be controlled by organic additives.
Our company has a competitive edge over other foreign companies being faster in mass production by responding to customers and extruding experimental results faster.
We have overcome our disadvantage of not being able to store imported organic additives more than 6 months, by localizing the production in Korea.

SmartPlate™

- High purity Cu deposition
- Excellent uniformity
- Smooth surface
- High bath stability
- Adjustable bump/pillar shape
- Easy process control & monitoring
- Long storage time
- Convenient after-sales service

Current Density Plating Speed Pillar Shape
5-12 ASD 1.0-2.5μm/min Flat or Dish
Resistivity(as-plated) Roughenss Uniformity
< 2.1 μΩ . cm 6.0 nm < 2 %

SmartVia™

CURRENT dENSITY 1.1 ASD

180 s

360 s

720 s

900 s

CURRENT dENSITY 1.3 ASD

150 s

300 s

600 s

700 s

Current Density Resistivity (as-plated)
0.5-1.3 ASD < 2.1 μΩ . cm