PIONEER OF DIGITAL TECH
PDT是一个设计并销售半导体制造设备、FPD制造设备等工厂自动化设备的尖端技术专业公司。化学电子材料<
SmartPlate™和 SmartVia™
以最尖端电镀技术,利用有机添加剂控制电镀的厚度、成型形状、平坦度、均匀度、
速度等铜电镀品质,可快速得到实验结果并对应客户,与使用其他国外产品相比客户
可以更快实现量产
SmartPlate™
- High purity Cu deposition
- Excellent uniformity
- Smooth surface
- High bath stability
- Adjustable bump/pillar shape
- Easy process control & monitoring
- Long storage time
- Convenient after-sales service
Current Density | Plating Speed | Pillar Shape |
5-12 ASD | 1.0-2.5μm/min | Flat or Dish |
Resistivity(as-plated) | Roughenss | Uniformity |
< 2.1 μΩ . cm | 6.0 nm | < 2 % |
SmartVia™
CURRENT dENSITY 1.1 ASD
CURRENT dENSITY 1.3 ASD
Current Density | Resistivity (as-plated) |
0.5-1.3 ASD | < 2.1 μΩ . cm |